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Intel says it has solved a key bottleneck in quantum computing


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EHW News Editor
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The breakthrough could lead to processors that integrate the electronics and the quantum chip on the same die. That, in turn, could make it much easier to scale quantum computers and have them tackle more of the calculations that would be difficult or impossible with traditional computing power.

 

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EHW News Editor
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Dreading the day we start hearing terms like "quantum crypto" or "quantum mining". 

The source article is pretty short, here is another article that has a lot more info on this: Quantum computing: Intel's cryogenic chip shows it can control qubits even in a deep freeze (msn.com)

 

Quantum computers need to be super cold, like just a few degrees above absolute zero. Intel didn't figure out how to solve that problem but rather they designed a more traditional chip that can operate at the same super cold temperatures that quantum chips work at. 

 

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Horse Ridge is a silicon-based CMOS chip, and as such was designed with a technology similar to that used in conventional microprocessors. The device was adapted to ensure the right operation even at cryogenic temperatures, which enables the chip to manipulate the state of qubits thanks to radio frequency pulses. 

The qubits manipulated by Horse Ridge are also silicon-based, contrary to the type of qubits that can be found, for example, in IBM or Google's quantum computers, which are superconducting qubits. While Intel initially pursued both approaches – superconducting as well as silicon qubits – the company's recent efforts have ramped up in the latter. 

This is because researchers are increasingly acknowledging that building quantum computers with techniques that are similar in nature to those used to produce most modern-day electronics could come with huge advantages when it comes to scaling the technology.  

What's more: with both qubits and the controller chip fabricated in silicon, Intel's researchers are hoping that it may be possible to one day fully integrate them both together in one die or package. This would greatly simplify the wiring challenge of quantum and enable strides in quantum scalability. 


 

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