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Nvidia 40 series 5nm, TSMC 3nm


UltraMega
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These are two separate articles but I figured it makes sense to post them together in the same thread. 

 

Nvidia 5nm:

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DigiTimes said that TSMC and other Taiwanese technology companies have secured Nvidia's business for both the future Hopper GPUs and the Ada Lovelace GPUs, which (hopefully) will be released next year.

 

With the current generation of Ampere-based GPUs, Nvidia splits chip production contracts, with the enterprise and high-performance computing (HPC) GPUs coming from TSMC and the consumer GPUs coming from Samsung, respectively.

 

According to the DigiTimes story, the H100 will be the first GPU based on the Hopper architecture, and it will be built on TSMC's 5nm process with CoWoS advanced packaging. Hopper GPUs will be ready for use in a variety of applications such as supercomputing clusters, data centers, and other similar environments. The ideas revealed by Taiwanese industry insiders shed some light on Ada Lovelace GPUs, according to the publication. GPUs based on the Ada Lovelace architecture will be used to power the GeForce RTX 40 Series of graphics cards, which will be targeted at enthusiasts and gamers. These GPUs, which are also manufactured by TSMC, are projected to be available starting in Q3 2022.

 

New Turing and Ampere GPUs targeted at the PC gaming sector will be the focus of Nvidia's upcoming launches, which will be rehashed and revamps of older Turing and Ampere GPUs. The GeForce RTX 2060 12GB is scheduled to be released soon, while the new Ti or Super variants of the RTX 30 Series should be available for laptops and desktops in early 2022.

https://www.guru3d.com/news-story/geforce-rtx-40-gpus-fabbed-on-tsmc-n5.html

 

 

TSMC 3nm:

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Unnamed industry sources told DigiTimes (paywalled, via MacRumors) that TSMC aims to start shipping 3nm chips to customers like Intel and Apple in the first quarter of 2023, which jives with earlier rumors on the subject.

 

The first 3nm chips from Apple are expected to ship in future Macs and iPhones as the M3 and the A17 Bionic, respectively. Last month, The Information said some Apple M3 chips could pack as many as four dies with up to 40 cores. For comparison, current-gen M1 Pro and M1 Max chips feature 10-core CPUs.

WWW.TECHSPOT.COM

Unnamed industry sources told DigiTimes (paywalled, via MacRumors) that TSMC aims to...

 

 

 

Also this:

Intel looking to 'avoid fighting' with Apple for TSMC's 3nm chip production

 

APPLEINSIDER.COM

A new report says that Intel executives are shortly to visit chip company TSMC, specifically to...

 

 

 

 

 

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1 hour ago, UltraMega said:

Also this:

Intel looking to 'avoid fighting' with Apple for TSMC's 3nm chip production

 

APPLEINSIDER.COM

A new report says that Intel executives are shortly to visit chip company TSMC, specifically to...

 

 

Maybe Intel should inform their idiot marketing department of this as well.

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  • 1 month later...
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Not necessarily "news" we don't already know, but it is related and it's up-to-date:

 

Bloomberg (via Yahoo): Chip Execs Say There’s No Short-Term Fix for Supply Shortage

 

Excerpts:

 

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For chip buyers ranging from computer gamers to automakers, there’s no near-term fix on the way for shortages that have caused higher prices and production delays, semiconductor executives said.

 

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For one of the companies that provides contract manufacturing, GlobalFoundries Inc., the surge in uses for chips coupled with the time it takes to increase capacity, means that this year will offer scant relief.

 

“It’s hard to imagine over the next two years a point where we don’t speak about supply issues,” Chief Executive Officer Tom Caulfield said during his appearance at the forum. “I don’t see any relief in 2022.”

 

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GloFo, didn't they kinda give up on pursuing modern nodes? Only thing I can still think of still using them in this space are the I/O dies for Zen 3 chips (if I recall correctly).

 

Anyway, not really surprised by this news. Can't just spin up more capacity anywhere be it GloFo, TSMC, or Samsung like that.

Edited by Sir Beregond
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