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Arm, Intel, TSMC, AMD, Google and more industry leaders form the Universal Chiplet Interconnect Express (UCIe)


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"It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and interconnected," Moore said.

 

From the early days of chiplet designs, companies have been using their own die-to-die interconnect systems. However, as chiplets become the new norm for CPUs and GPUs, developing an industry-wide standard would greatly help the industry, as manufacturing partners could use components from different ecosystems and still create an SoC with them.

 

The UCIe consortium looks to standardize an open die-to-die interconnect system at the package level that allows companies to use components from different sources to create GPUs, CPUs, SoCs, and more. Currently, UCIe 1.0 specifies the die-to-die I/O physical layer, protocol stack, software model (including PCIe and CXL standards), and compliance testing. 

WWW.TECHSPOT.COM

According to Gordon Moore, the number of transistors in an integrated circuit doubles every two years (Moore's...

Sounds like it could lead to some really interesting custom chiplets down the road. 

 

 

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