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Intel, AMD, Arm, and Others, Collaborate on UCIe (Universal Chiplet Interconnect Express)


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Intel, along with Advanced Semiconductor Engineering Inc. (ASE), AMD, Arm, Google Cloud, Meta, Microsoft Corp., Qualcomm Inc., Samsung and Taiwan Semiconductor Manufacturing Co., have announced the establishment of an industry consortium to promote an open die-to-die interconnect standard called Universal Chiplet Interconnect Express (UCIe). Building on its work on the open Advanced Interface Bus (AIB), Intel developed the UCIe standard and donated it to the group of founding members as an open specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level.

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Refreshing to see the competitor's come together for a common goal 

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CPU: AMD RX-427BB
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RAM: 128GB|16 x 8GB - DDR4 2400MHz (2Rx8)
MOTHERBOARD: HP Z840|Intel C612 Chipset
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SSD/NVME 2: Samsung 1TB 980 NVMe
SSD/NVME 3: 2x Seagate FireCuda 1TB SSD's
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